Sirus T2 Table Top RIE


The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.

  • MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.
Fluorine Etch Processes (SF6, CF4, CHF3, O2)
  • Carbon
  • Si
  • Epoxy
  • SiO2
  • InSb
  • Si3N4
  • Ir
  • SiC
  • Mo
  • Ta
  • Nb
  • TaN
  • OxyNitride
  • TiW
  • Polyimide
  • TiN
  • Pr (e.g: SiLK or SU8)
  • W
  • Quartz
Tool Standard Features
  • Sirus T2 reactor with 200mm bottom electrode
  • System controller (includes Pentium™ based computer and touch screen interface)
  • Two mass flow controllers
  • Automatic tuning with 13.56 MHz 600 watt RF generator
  • Emergency Off system
  • Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement)
  • 12 month limited warranty
Optional Features
  • Recirculating temperature controller
  • Up to two additional mass flow controllers
  • 170 l/s turbo
  • 23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil
  • The Sirus T2 system requires a roughing pump and either a chiller or cooling water with greater than 4 M ohm resistivity.

PTek, located at Hyderabad, is engaged in offering best equipment and services to the industry and research institutes in the field of Air Filter Testing, Aerosol generation, Semiconductor Process Equipment & Cryogenic systems.