Minilock – Phantom DRIE

The Minilock-Phantom DRIE is a Deep Reactive Ion Etch system that has been designed to etch silicon in both trench mode, and by fast switching of fluorine based gases. The small footprint and robust design make it ideal for research and pilot line environments. The module can be load locked for single wafer processing or coupled to our cluster platforms.

Applications

• Silicon Trench, MEMS